Maiwei Co., Ltd.’s self-developed fully automatic wafer-level hybrid bonding equipment is delivered to new customers

On July 15, Maiwei announced that the company’s independently developed fully automatic wafer-level hybrid bonding equipment was successfully delivered to new domestic customers.

Picture source: Maiwei Co., Ltd.

It is reported that Maiwei Co., Ltd.'s fully automatic wafer-level hybrid bonding equipment has the characteristics of modular design for easy installation and debugging, high-precision active leveling mechanism, and internal environment reaching class1 level. Key components of the equipment, including air float blocks, flexible hinge micro/macro motion tables, etc., are all independently developed by Maiwei Co., Ltd.

Maiwei said that the equipment delivered this time will help customers build efficient and advanced semiconductor production lines, significantly optimize product manufacturing costs, and enhance market competitiveness.

Information shows that Maiwei Co., Ltd. was established in 2019. It is a pan-semiconductor high-end equipment manufacturer integrating mechanical design, electrical research and development, software development, and precision manufacturing. It is based on the three key technology platforms of vacuum, laser, and precision equipment.

Maiwei's products mainly include fully automatic solar cell screen printing production lines, heterojunction high-efficiency battery manufacturing overall solutions, OLED flexible screen laser equipment, MLED full-line automation equipment solutions, semiconductor wafer packaging equipment, etc.

It is worth noting that in the field of Micro LED, Maiwei has independently developed a complete set of equipment for wafer bonding, laser stripping, laser giant rotation, laser bonding, laser repair, laser cutting, D2D bonding, and hybrid bonding.

In 2024, Maiwei Technology will successively deliver large quantities of transfer equipment and laser stripping equipment to customers, helping customers expand their Micro LED technology layout.

In June this year, Maiwei once again completed the delivery of Micro LED equipment, providing customers with its self-developed complete set of MIP transfer section solutions, including core process equipment such as laser stripping, laser mass transfer, laser cutting, etc., covering multiple key links from Micro LED chip epitaxial layer substrate stripping to mass transfer, cutting and separation.

In addition, it is worth noting that Maiwei Technology has also cooperated with domestic universities to jointly promote Mini/Micro LED technology research.

Just recently, a joint research team formed by Maiwei Technology (Zhuhai) Co., Ltd., a subsidiary of Maiwei Co., Ltd., and Guangdong University of Technology jointly developed a flying spin crystal mass transfer robot in the field of Mini LED to achieve mass shipments of Mini LED mass transfer production lines. In the field of Micro LED, the team has localized equipment such as laser stripping, giant rotation, bonding, and repair, and created the first overall solution for silicon-based Micro LED hybrid bonding wafer reconstruction, integrating semiconductor integration technology with new displays to find a new path for ultra-high-definition display mass production. (Source: Compiled by Maiwei Shares and LEDinside)

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