November 25 news, according to foreign media reports, in the first and second quarter financial analyst conference calls this year, TSMC CEO Wei Zhejia revealed that their 3nm process is progressing smoothly and plans to conduct risk trial production in 2021 and large-scale mass production in the second half of 2022.
New reports from the English media show that TSMC is advancing the large-scale mass production of the 3nm process in the second half of 2022 as planned. Sources revealed that TSMC has set a monthly production capacity of 55,000 wafers for this process in the second half of 2022.
With the extension of mass production time, the production capacity of the 3nm process will also increase. Foreign media reported in reports that the monthly production capacity of the 3nm process will increase to 100,000 wafers per month in 2023.
In previous reports, foreign media mentioned that TSMC has prepared four waves of production capacity for the 3nm process. Most of the first wave of production capacity will be reserved for Apple, and the latter three waves of production capacity will be booked by Qualcomm, Intel, Xilinx, Nvidia, AMD and other manufacturers.
3nm process is another generation of chip process technology that TSMC has significantly improved after the 5nm process that was mass-produced in the first quarter of this year. At the financial analyst meetings in the first and second quarters of this year, Wei Zhejia talked about the 3nm process. He revealed that compared with the 5nm process, the 3nm process will increase the density of transistors by 70%, the speed of the chip by 10% to 15%, and the energy efficiency by 25% to 30%.
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