Zhaochi MicroLED CPO optical chip officially delivers samples

After the Wuhan Optical Communications R&D Center was officially put into operation, Zhaochi Technology once again made important progress in its optical communications business layout.

On March 12, Zhaochi announced that the Micro LED light source chip for Micro LED optical interconnection CPO (co-packaged optics) technology has successfully completed the research and development work and is currently in the sample verification and testing stage.

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It is reported that Micro LED optical interconnection CPO technology combines Micro LED light source and CPO co-packaging technology, which can effectively realize high-speed optical signal transmission and highly adapt to the application needs of high-end optical interconnection scenarios.

A TrendForce survey report shows that the Micro LED CPO solution has extremely low unit transmission energy consumption and can significantly reduce the overall energy consumption to about 5% of the copper cable solution. This significant energy-saving advantage makes it regarded as a key alternative for short-distance optical interconnection in AI data centers.

Zhaochi Co., Ltd. stated that the successful sample delivery of the core optical chip marks the company's technical layout in the field of Micro LED optical interconnection CPO and has achieved key results, laying a solid foundation for the subsequent industrialization of related technologies.

Zhaochi's high-speed optical module project was launched; the laser chip production line was completed

While making breakthroughs in Micro LED light source chips, Zhaochi also revealed the latest progress in the construction of high-speed optical module projects and laser chip projects.

Previously, in order to accelerate the development of optical communication business, Zhaochi Technology has successively invested in and built an annual output of 100 million optical communication semiconductor laser chip projects (Phase I) and optical communication high-speed module and optical device projects (Phase I) through its subsidiaries Zhaochi Semiconductor and Zhaochi Optical Network.

At present, in the high-speed optical module project, Zhaochi has completed the construction of a clean intelligent manufacturing base of nearly 50,000 square meters and has fully put it into operation. In terms of production capacity, 200G and below optical modules have successfully achieved large-scale production; the first batch of full-process manufacturing production lines for 400G and 800G parallel optical transceiver modules have completed the installation and debugging of equipment. After completing reliability testing, they have successfully entered the small-batch production stage and are currently advancing to the large-scale mass production stage in an orderly manner; In addition, the 1.6T optical module for next-generation transmission needs has also entered the rapid research and development stage. The company is conducting parallel technical research around multiple paths such as LPO, NPO, and CPO, and is committed to building the next generation of high-speed, low-power solutions.

Zhaochi Co., Ltd. has also made significant progress in the laser chip project. The company initially configured 20-cavity MOCVD (Metal Organic Chemical Vapor Deposition) equipment that is compatible with LED gallium arsenide chip and laser chip production lines. By adding some back-end equipment, it has successfully built a laser chip production line.

Zhaochi Co., Ltd. stated that the company can flexibly coordinate the production capacity allocation of LED gallium arsenide chips and laser chips based on product development, verification and testing progress, and customer order needs, thereby effectively ensuring the production capacity supply of laser chips. At present, Zhaochi's 25G DFB and below speed optical chips have completed research and development and trial production, and are gradually transitioning smoothly to the mass production stage; high-power series CW DFB laser chips and 50G EML laser chips used in 400G, 800G and even 1.6T optical modules are also steadily advancing research and development according to established plans.

It is reported that since 2023, Zhaochi has begun to further focus on in-depth layout in the field of optical communications. After continuous investment, it has initially built a vertical industry chain covering terminal optical communication devices, optical modules and core component optical chips.

The delivery of samples of Micro LED optical chips and the steady start of production of two core projects are deeply in line with Zhaochi's strategic development plan. It not only accelerates the layout of the entire optical communications industry chain, but also further promotes the transformation and upgrading of the company's overall industry, injecting new momentum into sustainable development.

Zhaochi also objectively reminded in the announcement that the laser chip and high-speed optical module projects are currently in the early stages of production, and subsequent production capacity ramp-up and market expansion will still take a certain period of time. In the future production and operation process, the project may face the impact of uncertain risks such as changes in the market environment, industry policy adjustments, changes in the competitive landscape, and fluctuations in terminal demand.

No.(LEDinside).