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Huawei applied for patents for light-emitting chips and their preparation methods, display modules, and electronic equipment to improve the luminous efficiency of small-size Micro LEDs

News on May 7, 2024: According to an announcement from the National Intellectual Property Administration, Huawei Technologies Co., Ltd. has filed a patent application titled Light-emitting Chip, Preparation Method Thereof, Display Module and Electronic Equipment, with the publication number CN117995965A. The application date was October 2022.
According to the patent abstract, the embodiments of this application disclose a light-emitting chip, its preparation method, a display module and electronic equipment, which belong to the field of display technology, aiming to improve the luminous efficiency of small-size Micro LED chips.
The light-emitting chip consists of a first electrode, a first semiconductor layer, a light-emitting layer, a second semiconductor layer and a second electrode arranged in a stacked structure. One of the first semiconductor layer and the second semiconductor layer is an N-type semiconductor layer, and the other is a P-type semiconductor layer. At least part of the edge of the first electrode is inwardly retracted relative to the edge of the first semiconductor layer.

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