LED modularization -- new trend of LED development

Abstract: lighting is the basic demand of human beings, and the lighting also represents the level of economic activity. In recent years, due to the global economic growth, sustainable city, non urban factors of power network expansion construction, driven general buildings and manufacturing factories are increasing, making the lighting demand rapid growth, energy consumption continued to increase. As a new light source, LED is being more and more integrated into people's lives, its development can not be separated from the demand for lighting. Compared to traditional light sources (such as fluorescent lamp and incandescent lamp), LED is nearly 5-20 times higher than the traditional light source when it is close to the theoretical conversion efficiency. Even at this stage of the production of light efficiency, the level is also between 2-15 times, combined with the advantages of its directivity, the gap will be greater. Due to the change of the luminous principle, its life will be much higher than the traditional light source. In addition, because LED has a series of advantages, such as health and environmental hazards, it has been recognized as the most suitable light source for the next generation. However, LED lighting has not been widely used, can not enter thousands of households, the main reason is the high price of LED lighting, LED lighting, how to reduce the price, market and experience tells us that the ---LED module.

LED modular development model: light source module (1), (2) +PCB device integrated board, (3) light source and power supply integration, (4) light source, power supply, heat dissipation and optical integration, (5) the connection port, the base of standardization. As the LED vertical integration of enterprises, industrial group, the original LMDM lighting integration service plan, provide customized lighting solutions for customers, and in the development stage of each product to help customers solve the light, heat, electricity, four key technical difficulties on the machine etc.. This article mainly from the LED light source module, standard interface, heat dissipation design and so on.

The light source module includes two modes: COB and +PCB. See figure.

The light source module includes two modes: COB and +PCB. See figure.

1.COB chip On board package COB package, is the bare chip with conductive or non-conductive adhesive adhesive on the interconnection substrate, and then realize the electrical connection of wire bonding (flip chip mode without wire bonding), LED chip and substrate integrated technology. COB packaging can be divided into two categories: (1) low thermal resistance packaging process; (2) high reliability packaging process. (1) low thermal resistance packaging process low thermal resistance COB package is currently divided into aluminum substrate COB, copper substrate COB, ceramic substrate COB.

Due to the low cost of the aluminum substrate COB substrate, so the COB light source package out with high price, in addition, the highest light effect can be achieved 130LM/W, more widely used with the LED bulb lamp based on LED lights and lamps, but because the aluminum substrate thermal conductivity limit (currently the conventional substrate thermal conductivity in 1-2W/m.K), suitable for 5-10W COB source. The copper substrate COB, the chip is directly fixed on the copper above, the thermal conductivity of copper in 380W/m.K, thermal effect is good, can 20-50W package COB, and optical efficiency of up to 130LM/W, is widely used with LED lights, LED lights and other lighting, but in order to prevent local overheating, generally about 20-50W COB light source package. Ceramic substrate COB ceramic is currently recognized as the most suitable for LED substrate material, with its excellent thermal conductivity, excellent insulation performance, has the advantages of small thermal deformation and wide application of high-grade, high reliability LED lamps, currently available package 10-50W COB light source, but because of its base price is more expensive, generally used for high-end LED lighting and lighting in the field of high reliability requirements.

(2) high reliability packaging technology at present in some special occasions, lighting, reliability of the LED lighting requirements are particularly high, such as LED lights, LED tunnel lamp, LED lamp, LED lamp, LED light source based on the reliability requirements are very high. As one of the most important influence on the reliability of LED package, the first three effects (heat effect, electrostatic effect, humidity effect) are the main cause of LED attenuation. LED chip for the Arrhenius model, the junction temperature of LED increased by 10 degrees C, LED's own life will be reduced by half of the 1. P=P0exp (beta T) P0- initial optical power, beta attenuation coefficient, t-LED aging time = (-Ea/kTj) 0Ifexp beta beta beta 0- constant, k- Boltzmann constant temperature section, Tj- chip, Ea- activation energy with high heat conduction and insulation performance as the ceramic substrate, can solve the thermal effect and electrostatic ring in addition, the ceramic substrate and silica gel with good performance, which can solve the influence of moisture, in addition to the use of flip chip technology to remove gold further greatly improves the reliability of the light source module, using COB light source module packaging to improve the price, therefore, using ceramic substrate COB and flip chip technology can meet the application field of LED high requirements.

2 light source device +PCB light source device +PCB light source module, aimed at promoting the standardization of light source module, convenient LED lamp manufacturers manufacturing process.

Only in 3014 and 5630 illustrate, and Imitation Ceramic 35353528 lumens, light source device and application of +PCB mode, LED lamp, LED lamp, LED fluorescent lamp, LED bulb lamp, LED lamp, LED lamp manufacturers great convenience.

[1] [2] next page