LED package can be applied to the design of a reasonable link between the preceding and the following

Led gradually replace the traditional incandescent lamp to the backlight and lighting applications market, compared with the traditional incandescent light source LED LED has many advantages, long service life, high efficiency, no damage, no mercury, does not produce toxic gases, low power consumption... And so on, for our environment LED is nothing more than the best alternative to light source, while LED is known as the new light source in twenty-first Century.

In the LED process, packaging is a very important part, the role of packaging is to connect the external lead to the LED chip electrode, not only to protect the LED chip, and improve the luminous efficiency. Therefore, the LED package is not only to complete the output signal, the more important is to protect the normal operation of the core, the output of the visible light function. However, no matter what kind of LED needs to be designed for different types of reasonable packaging form, can be put into practical application.

Along with the application of LED in different ways, cooling scheme and luminous effects and shape and size will vary, according to the LED package can be divided into Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, FlipChip-LED... 6 categories.

In the whole LED industry chain, packaging is the transitional part, the traditional low order LED used for outdoor billboards or display lights, for the selection of liquid epoxy resin packaging material, with LED to indoor lighting and backlighting applications, high power, high brightness LED become the focus of development, high power LED must reduce, increase the light shielding the rate of penetration and enhancement of light refraction and reflection of the utilization, from the bare crystal to overcome problems into the brightness after packaging, packaging process! How to make the luminous flux to maintain the highest, light attenuation is the most critical.

In the past packaging material LED is the most commonly used epoxy resin (epoxy), epoxy resin packaging process is relatively simple, low cost, so the current in the LED packaging material market share is high, but the drawback is that the impact damage resistance ability is low, poor toughness and heat resistance of less than 170oC, because the benzene ring becomes yellow after aging ingredients then, influence of bright colors, especially wavelength less aging faster, especially the part of white light emitting diode using near ultraviolet (Nearultraviolet) light, and other visible light wavelength and compared the lower, faster aging. Therefore, in order to cope with the aging problem caused by high power LED, the choice of packaging materials should be considered as a packaging material with high heat resistance silicone.

Replaced with silicone epoxy resin has a higher lumen retention rate (Transmittance, light transmittance, penetration rate, as a percentage of units), such as the Luxeon series LED of Lumileds company in the United States is changed to silicone encapsulation, other industries also have silicone encapsulation scheme, such as the company's InvisiSi1 (Momentive), Dongli. Dao Kangning (DowCoringToray), Japan Shin Etsu chemical KER-2500AB is also silicone package LED.

In addition to the wavelength range of 300~350nm in the low wavelength of silicone has better resistance, not easy to aging, in addition, silicone light transmittance, refractive index, heat resistance are better than epoxy resin ideal. At present, the refractive index of silicone is up to 1.4~1.5, and the refractive index of the future will be more than 1.6 silicone.

Silicone high power LED light source and LED backlight TV packaging solutions, silicone packaging for various types of packaging forms, but still need to package the size, suitable for material selection of power.

Due to the long time use of methyl silicone heat resistance up to 200oC, compared to epoxy resin UV, weather resistance, and even life is more dominant. As for the LED backlight package requires moisture permeable low oxygen material, but also the development and application of the public silicone vendors rush into. The only problem is the current high price of cost, and with high temperature, PPA, silver plated ceramic substrate package after high humidity test, then silicone is still not perfect, the solution is to improve the silicone and then the body was then and matching, together with extend the baking time, then to improve the current the problem of.

Insiders said: at present the cost price by silicone package for maximum industry to consider, but because silicone has good heat resistance, seasonal, UV resistance, electrical insulation, chemical stability, release and so on many reasons, can gradually replace epoxy resin has become the main show of the LED packaging material, to be the market economy reached tens of tons more than the amount of time the price will be expected to have a larger space, estimated in the backlight and lighting market penetration increase, will have the opportunity to happen.