Layout of Mini LED packaging materials, Commet North Exchange IPO meeting

On April 30, Beijing Kangmet Technology Co., Ltd. (hereinafter referred to as "Commet") passed the review of the Beijing Stock Exchange Listing Committee and plans to land in the capital market.

Kangmet was registered and established in the core area of Zhongguancun National Independent Innovation Demonstration Zone in 2005. It is a national high-tech enterprise focusing on the research and development, production and customized services of new polymer materials.

The company's main business is high-end electronic packaging glue, and it is the core supplier of Mini LED packaging materials in China. Its products are widely used in semiconductor lighting, new displays, IGBT, electronic appliances, aerospace, energy-saving building materials and other fields.

In the field of new displays, the company has been laying out Mini/Micro LED technology since 2018 and has achieved mass production of Mini LED silicone encapsulants.

In terms of customer development, Commet has established cooperative relationships with well-known domestic enterprises such as Hongli Zhihui, Ruifeng Optoelectronics, Nationstar Optoelectronics, Zhaochi Co., Ltd., BOE, Huawei, TCL Technology, Hisense, etc., and maintains stable cooperation with ams Osram, Samsung Electronics, Philips, Everlight Electronics, Lite-On Technology, Seoul Semiconductor and other enterprises.

According to the latest prospectus, from 2023 to 2025, Kangmet's operating income was 384 million yuan, 423 million yuan and 469 million yuan respectively; the net profits attributable to the owners of the parent company were 45.1351 million yuan, 62.7007 million yuan and 85.3272 million yuan respectively.

From January to March 2026, the company achieved operating income of 110 million yuan to 120 million yuan, a year-on-year increase of 10.29% to 20.32%; the net profit attributable to the owners of the parent company was 20 million yuan to 23 million yuan, a year-on-year increase of 15.51% to 32.83%.