MicroLED related company Leiming Laser will build a base in Neijiang, Sichuan

On March 10, Sichuan Neijiang High-tech Zone held a centralized signing ceremony for investment projects. Three new high-tech industrial projects were signed this time, with a total investment of 1.6 billion yuan. The projects involve the research and development and manufacturing of high-end semiconductor equipment parts, laser cutting equipment, and advanced packaging equipment.

This includes the Suzhou Leiming Laser Technology Co., Ltd. project. This project will invest in the construction of a high-end semiconductor equipment manufacturing and wafer processing operation base in Neijiang High-tech Zone.

Leiming Laser mainly engages in the research, development, production and sales of ultra-precision laser equipment for various high-end industrial applications. Its main products are laser cutting equipment, which are used in semiconductor packaging, Micro LED chip manufacturing and other related processing fields.