Cao Longquan, Professor of material engineering of Pingtung University of science and technology in Taiwan, invented special solder to allow LED thickness to be less than 0.1 centimeters. LED lamps and lanterns are as thin as paper, with high heat dissipation and won the gold medal for International Invention Exhibition.
At present, high power LED lamps and lanterns module, most of the use of traditional packaging technology, because the need for metallization, joint alloy, expensive and the thinnest of the thickness is still more than 1.5 centimeters, high thermal resistance coefficient.
Through special solder, Cao Longquan joins and fixates the LED chip directly, the high power LED lamp module made of special solder, reducing the package step, the layer and the thickness, and having the high heat dissipation effect, making the LED thickness less than 0.1 centimeters, as thin as paper, and lowering the cost by 20 times.
Cao Longquan's "thin, high power LED lamp" was invented in the 2015 (eleventh session) Taipei international invention and technology trade exhibition won the gold medal. In addition, it also has the gold medal of "multi power dismantling baby bed", "IC chip copper bump surface tin coating treatment and the advanced packaging technology of tin substrate".
For more information on LED, click on the Chinese LED network or pay attention to the WeChat public account (cnledw2013).
Contact: mack
Phone: 13332979793
E-mail: mack@archled.net
Add: 3rd Floor, Building A, Mingjinhai Second Industrial Zone, Shiyan Street, Baoan, Shenzhen,Guangdong,China