Cao Longquan, Professor of Materials Engineering Institute of Pingtung University of science and technology in Taiwan, invented special solder to make LED thickness less than 0.1 centimeters. LED lamps are as thin as paper, with high heat dissipation effect and won the gold medal of the International Invention Exhibition.
At present, high power LED lamps and lanterns module mostly use traditional encapsulation technology. Because of metallization, the alloy is expensive and the thickness is thinner than 1.5 cm, and the thermal resistance coefficient is high.
Through the special solder, Cao Longquan directly connects the LED chip to the high-power LED lamp module made of special solder to reduce the packaging steps, layers and thickness, and also has high heat dissipation effect. The thickness of the LED can be less than 0.1 cm, as thin as paper, and the cost is reduced by 20 times.
Cao Longquan's invention of "thin and high-power LED lamps" won the gold medal in the 2015 Eleventh International inventions and technology trade exhibition in Taipei. In addition, there are also "multi-functional detachable cribs", "IC chip copper bump surface tin coating treatment and tin substrate advanced packaging technology" to win gold medals.
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