SMD LED package: the cake is ignored - SMD LED packaging capacity will not be excessive, but will benefit from excess capacity in the upper reaches

, SMD led rapid development, but in the packaging industry accounted for a relatively small patch type light-emitting diode (SMD LED) is a new type of surface mounted semiconductor light emitting device has the advantages of small volume, light scattering angle, good uniformity, high reliability, a variety of colors including white, light color and so it is widely used in various electronic products. SMD LED products decreased than the other LED products have great brightness improvement and cost in the upstream end chip space, have greater market demand in the downstream application, especially in the large size LED backlight and LED lighting. From a global perspective, Taiwan Chinese packaging production occupy the first world (more than 60% of the world), the main enterprises billion light, Guang Lei, Bai Hong, Wang Lite, Qi, industry supply stable clear division of labor, industrial chain, especially to China after the packaging manufacturing cost is competitive, is expected in the future 5-10 years, the Pearl River Delta, Yangtze River Delta, Fujian and other regions will become the world LED packaging center. From the mainland market, the domestic market in SMD LED a few years ago almost completely occupied by the United States, Japan, South Korea and Taiwan suppliers. Although foreign manufacturers still occupy most of the market share, but since 2000, Foshan City Star Optoelectronics Technology Co., Ltd. SMD LED products put into operation, the rapid growth of local suppliers in china. Now, the industry has 20 to 30 suppliers, most companies are concentrated in Guangdong, Shenzhen, Dongguan, Guangzhou and Foshan, a small number of enterprises in Jiangsu, Zhejiang and Fujian. Industry leading enterprises including Foshan nationstar optoelectronics, Guangdong honglitronic, Shenzhen Ruifeng optoelectronics, Jiangsu Wenrun optoelectronic and optoelectronic etc.. From the production point of view, Taiwan, mainland enterprises large gap. Table 1:2009-2010 Taiwan, SMD LED, the main comparison of production enterprises

Company location

Corporate name

2009 capacity (KK/ months)

2010 production forecast

Taiwan

Billion light

One thousand

Two thousand

Donper

Four hundred

600-800

Baihong

Three hundred

350-400

Wang Qi

Five hundred and fifty

Six hundred and fifty

advanced

Three hundred and fifty

Four hundred and fifty

Mainland

Nationstar

Two hundred

Two hundred and fifty

Kyushu

One hundred and fifteen

One hundred and fifty

Ruifeng

Fifty-seven

Eighty-five

Data source: National Semiconductor Lighting Industry Alliance CSA however, LED continued on the upgrade package, but a small part of SMD LED's market share has accounted for only Chinese LED packaging industry, 2007 sales of only 10% to 15%. Over the past five years, when the entire LED industry production and sales were increased by 30% and 20%, the growth of the SMD LED industry is still relatively slow compared to the entire industry, in 2008 SMD LED revenue growth of only between 5% to 10%. Two, SMD LED packaging technology high technical barriers traditional Lamp LED has been developed to a relatively mature industry with lower barriers to entry, the product has entered the stage of price competition. The industrialization of key production technology of SMD LED is still only a small number of large enterprises to master, for miniaturization or power requirements, packaging technology is Lamp LED have fundamental differences, industry high barriers to entry, mainly reflected in the following aspects: 1 manufacturing technology A. and traditional Lamp compared to LED, SMD LED in the Chip LED volume is very small, such as mobile phone special ultra-thin Chip LED thickness of only 0.3mm. The Chip LED package to solve a series of problems brought by the micro structure including control circuit board thickness, control equipment and mold precision control, wire bonding process of gold radian, dicing dimensions, plastic deformation of PCB resin and PCB epoxy, combined with the problems of B. compared with the traditional Lamp LED, high power LED package in SMD need to be solved by the large amount of radiation, light distribution requirements of a series of problems, including: high has high light efficiency, good radiating effect, suitable scaffold design technology for mass production, the new heat sink thermal isolation design technology, different precision optical design of optical characteristics of the corresponding and precision mold technology, new type of solid crystal technology in the mass production test grading technology, multilayer encapsulation structure design technology C. current Chip LED white light technology Relatively mature, the key production technology of high power white LED needs to further enhance the production process and technical difficulties are as follows: A. blue LED chip coated with YAG (yttrium aluminum garnet) fluorescent powder, using a chip blue excitation phosphors emit yellow green light, yellow light and blue light synthesis. The preparation process is relatively low, high efficiency and high practicability. But because the carrier of the viscosity of impact of dynamic parameters, the fluorescent powder can precipitate and distributor limited precision caused by such factors as the proportion is greater than the carrier adhesive, coating the fluorescent powder process uniformity is difficult to control the use of RGB B. (red, green and blue three colors) multiple chips or a plurality of light-emitting devices mixed white or yellow green with blue chip with dual chip color to produce white light. This mode of production of white LED can obtain high color index, wide color gamut, but due to the existence of optical parameters between chips (such as wavelength, intensity) and electrical parameters (such as voltage difference), light attenuation is not consistent, so how to control light parameters is the key technology route. C. was coated with RGB phosphor on the UV chip, and the three primary colors were mixed to form white light. The main problem is that UV chip and RGB phosphor efficiency is low, the epoxy resin under UV irradiation aging process is easy to decompose 2 learning curve SMD management and LED package belongs to the super fine and mass production.