Shixin cooperation with SONY to provide advanced semiconductor packaging solutions

Ethertronics (AlchipTechnologies) before the date announced with SONY semiconductor division (SONYSemiconductorGroup) has become the packaging technology partners, to enhance its global customer solutions and services in advanced SoC/ASIC.

Shixin president and CEO Guan Jianying said that today's products require a minimum chip size, increase the memory capacity and the integration of different types of memory in a multi chip package (Multi-ChipPackage). Through SONY's advanced technology and the ability to shorten the duration of the world core listed, we will be able to assist customers to use more advanced solutions.

The main business includes ethertronics for diversified Fab selection scheme, and designed for mass production and service SoC is designed to provide complete solutions. The company can provide packaging technology for high yield, and the development experience in the mobile phone, portable game machine and consumer products, and the SONY and semiconductor division agreement is expected to effectively enhance the company to customers a complete ASIC solution service.

Source: RFID world network