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Another 4 LED-related patent applications were successfully applied!

Unilumin Technology applied for patents for LED packaging devices and their manufacturing methods, LED modules and their manufacturing methods to improve the splicing display effect

On February 19, 2024, according to the announcement of the State Intellectual Property Office, Shenzhen Unilumin Technology Co., Ltd. applied for an application titled "LED packaging devices and their manufacturing methods, LED modules and their manufacturing methods", with the public number CN117558857A, and the application date is November 2023.
The patent summary shows that this application relates to an LED packaging device and its manufacturing method, LED module and its manufacturing method. The LED package device includes: a substrate; an LED chip, the LED chip is disposed on the substrate; an encapsulant, the encapsulant is disposed on the substrate and covers the LED chip; the encapsulant includes a first section and a second section located on top of the first section; the first section and the second section have an integrated structure; the orthographic projection of the second section on the substrate is within the orthographic projection of the first section on the substrate; and a light-blocking wall, which covers the outer side of the second section, and is arranged around the LED chip. The light-blocking wall can block the lateral light emission of the LED package device, so that the LED package device is configured as a top light-emitting device. When LED modules including multiple LED package devices are spliced ​​into a display screen, it is helpful to avoid problems such as colored lines and dark bright lines at the splicing caused by lateral light emission. This can improve the splicing display effect.
Yuanheng Optoelectronics applied for a patent for LED display module and its packaging process

On February 10, according to the announcement of the State Intellectual Property Office, Shenzhen Han’s Yuanheng Optoelectronics Co., Ltd. applied for a patent called “an LED display module and its packaging process”, with the public number CN117542931A, and the application date is December 2023.

The patent abstract shows that the present invention discloses a packaging process for an LED display module, which includes the steps: S1: Set the LED display module to be packaged in a glue filling fixture; S2: Dispense glue into the gap between adjacent LED lamp beads of the LED display module to be packaged and the LED display module to be packaged. The display module is surrounded by the glue filling fixture in the annular glue filling groove formed around it, and the height of the glue packaging plane is controlled to be lower than the highest surface of the LED lamp bead; S3: Vibrate the glue filling fixture to keep the height of all glue packaging planes consistent, and vacuum to remove bubbles inside the glue, eliminate glue voids, and finally solidify the glue. Correspondingly, the present invention also discloses an LED display module, which includes: PCB board and a plurality of LED lamp beads, the plurality of LED lamp beads are distributed in an entire row on the surface of the PCB board, and the distance between two adjacent LED lamp beads is P≤2.5mm. The LED display module is packaged based on the above-mentioned packaging process of the present invention.

Qianzhao Optoelectronics has obtained a new invention patent authorization


According to Qichacha data, Qianzhao Optoelectronics (300102) has obtained a new invention patent authorization, and the patent is called " Flip chip of light-emitting diode and its manufacturing method and etching method", the patent application number is CN201810885637.1, and the authorization date is February 13, 2024.


Patent abstract: The present invention discloses a flip-chip of a light-emitting diode, a manufacturing method and an etching method thereof, wherein the flip-chip includes an epitaxial unit, a reflective layer stacked on the epitaxial unit, an anti-diffusion layer stacked on the epitaxial unit and covering the reflective layer, a first insulating layer stacked on the anti-diffusion layer, a current spreading layer stacked on the first insulating layer, and a stacked In an electrode group of the current expansion layer, the first insulating layer has a plurality of connection pin channels for accommodating the connection pins of the current expansion layer, and the inner wall of the first insulating layer used to form the connection pin channel is a multi-section inner wall. In this way, the bonding area of the first insulating layer and the current expansion layer can be expanded, thereby improving the reliability of the flip chip.


Ming Microelectronics applies for LED display energy-saving control patent


On February 9, according to the announcement of the State Intellectual Property Office, Shenzhen Mingwei Electronics Co., Ltd. applied for a project called "An energy-saving control method and device for an LED display screen", with the public number CN117542308A, and the application date is August 2022.

The patent summary shows that this application provides an energy-saving control for an LED display screen Method and device, the energy-saving control method includes: obtaining the working status parameters of the first channel in the next scan line during the line change period, wherein the LED display screen includes at least one channel, and the first channel is any one of the at least one channel; judging according to the working status parameters whether the drive circuit of the first channel enters the energy-saving working mode in the next scan line; if so, controlling the drive circuit to run in the energy-saving working mode in the next scan line. The energy-saving control method provided by this application can increase the number of times the drive circuit enters the energy-saving mode, thereby further improving the energy-saving efficiency of the LED display screen.





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