New Display
Strengthen the construction of innovation platforms. A one-time reward of 3 million to 5 million yuan will be given to scientific and technological innovation platforms that are promoted to national key laboratories and technological innovation centers in the new display field. If it is recognized as a provincial manufacturing innovation center, it will be given a financial support of 3 million yuan. If it is upgraded to a national manufacturing innovation center, corresponding support will be provided in accordance with relevant national regulations.
Improve the supporting industrial chain and focus on strengthening, replenishing and extending the chain. Enterprises that provide independently developed raw materials or component products for the first time and form an effective supply chain for new display enterprises will be given a one-time reward of up to 5 million yuan based on 10% of the first-year sales contract between the supply and demand parties (5% for each party).
Create a cluster “leader”. Vigorously cultivate new display small and medium-sized enterprises with strong innovation capabilities, great development potential, and excellent quality and efficiency. For "front-runner" enterprises that update advanced production, research and development, testing, and testing equipment in the previous year, a subsidy of 20% of the actual investment will be provided, with a maximum subsidy of 5 million yuan.
Support investment promotion. Support relevant cities to formulate support measures with reference to the best investment policies of domestic cities, and support the introduction of strong chain projects, as well as upstream key materials and equipment, downstream intelligent terminals and other chain-replenishing projects. For major projects that introduce domestic advanced technology, have large investment volume, and have mature operation teams, we will adopt a "one case, one discussion" approach to support them.
Promote the gathering of industrial talents. Encourage universities in the province to add new display-related disciplines. Increase support for academician workstation and postdoctoral workstation projects, and provide financial support after identification. Support will be given to leading talents and teams that come to Hebei for innovation and entrepreneurship with technology, achievements, and projects and will be included in provincial science and technology plans if they meet the conditions. For professional and technical personnel from non-public enterprises to apply for professional and technical qualifications for the first time, a "one-stop" policy will be implemented.
Strengthen financial empowerment. Give full play to the role of existing government investment guidance funds, encourage local governments to set up sub-funds, form a "mother-child fund" operating structure, and focus on investing in new display companies and key projects; encourage social capital to establish industrial development funds in accordance with market-oriented principles to provide financial support for high-growth innovative enterprises.
Guide banking financial institutions to optimize credit structures and approval processes, encourage government financing guarantee institutions to provide credit enhancement services to qualified enterprises, and reduce guarantee rates. Encourage securities and futures operating institutions to increase services for related financial products, issue innovative bond varieties such as green bonds and science and technology bonds, and support qualified listed companies to raise funds through additional issuances, allotments, issuance of convertible bonds, corporate bonds, etc.
Third Generation Semiconductors
Support design R&D verification. For third-generation semiconductor design companies with independent intellectual property rights, if the new products they develop and design pass user verification and generate sales revenue, they will be given a subsidy of 30% of the annual first project tape-out (including mask production) costs, with a maximum of 10 million yuan for a single company. Third-generation semiconductor design companies that purchase localized IP cores and EDA software for R&D and design will be given a subsidy of 30% of the annual purchase cost, with a maximum subsidy of 5 million yuan for a single company.
Create an integrated circuit industry cluster in the Beijing-Tianjin-Hebei region. Encourage the establishment of an incentive mechanism for cooperation in the Beijing-Tianjin-Hebei industrial chain, support third-generation semiconductor companies in the province to actively connect with Beijing and Tianjin, carry out industrial chain cooperation, and create a Beijing-Tianjin-Hebei integrated circuit industry cluster that integrates design, manufacturing, packaging and testing, materials and equipment. Provide preferential support to cluster enterprises in participating in various project applications and pilot demonstrations.
Cultivate enterprises to become stronger and better. A one-time financial support of 2 million yuan will be given to third-generation semiconductor companies that are rated as national manufacturing individual champion companies or individual champion products. Financial rewards will be given to third-generation semiconductor companies that are rated as national specialization and new "little giants".
Support the construction of major projects. Organize and implement a number of technological transformation projects in the fields of key third-generation semiconductor chips and devices, substrates and epitaxy, and photoresist. Actively strive to include key third-generation semiconductor projects under construction and planned into the national "14th Five-Year Plan" major project reserve.
Encourage product innovation and application. Support the market development of third-generation semiconductor materials, chips, devices and other products, and provide a one-time reward of up to 5 million yuan based on 10% of the first-year sales contract between the supply and demand parties (5% for each party) for application companies that provide independently developed products for the first time.
Support the organization of industry events. Support industry organizations such as the Provincial Semiconductor Industry Alliance and the Provincial Third-Generation Semiconductor Industry Innovation Consortium to use their own advantages to carry out policy consultation, industry-demand docking, investment promotion and other activities. Strengthen cooperation with national high-end think tanks and the China Semiconductor Industry Association, China Photovoltaic Association, and the Third-Generation Semiconductor Industry Technology Innovation Strategic Alliance. With the help of China International Digital Economy Expo, Baishishan Third-Generation Semiconductor Summit and other platforms, we will hold high-level summits, annual meetings, academic exchanges and other activities, and adopt a "one issue, one discussion" approach to support.
Optimize industry supervision services. New construction, renovation and expansion of third-generation semiconductor industry projects include a small amount of surface treatment processes such as electroplating, painting, pickling, etching (including circuit board etching), but if they are not the main production process, they will not be regarded as surface treatment construction projects. According to the category of hazardous chemicals involved in the enterprise and the degree of danger of the production process, precise supervision will be implemented based on classification and classification.
ANNA