Up to now, Ledman Optoelectronics has successfully achieved mass production of P1.9, P1.5, P1.2, P0.9 and other micro-pitch products. Its products have been applied in batches in more than 20 domestic industries and regions and ten overseas countries, and its technical level is industry-leading.
LED small-pitch display is a high-growth market. In order to solve the problems of LED small-pitch display, various LED display companies are exploring different technical solutions in the field of LED small-pitch display. As the first listed company in the LED display field, Ledman Optoelectronics has been working hard for ten years and is the first to launch COB high-definition micro-display products.
Currently, COB technology is a leading technology in the field of LED small spacing, with less competition and a blue ocean in the industry; in terms of large-size commercial displays, COB can bring greater value to commercial displays. COB display technology is currently the best technology for P2 to P0.5 LED small pitch. COB micro-display products have outstanding display effects, far exceeding the display effects of ordinary traditional LEDs on products.
As the domestic leader in COB microdisplays (called MicroLED by peers such as Samsung and Sony), Ledman Optoelectronics has long been engaged in the research, development, production and sales of LED packaging devices and LED displays. As a cross-border product between LED packaging and LED display, COB microdisplay reflects Ledman Optoelectronics' profound technological accumulation in the LED field.
As of the first quarter of 2019, in the field of LED packaging and display, Ledman Optoelectronics has nearly 280 valid patents, of which 230 have been authorized. About 60% of these patents are packaging technology patents.
COB microdisplay is an integration of LED packaging technology and LED display technology. 70% of the technology is packaging technology. Therefore, packaging technology is the main technical difficulty of COB microdisplay.
Ledman Optoelectronics began to develop COB display products in 2014. More than ten years of long-term investment and accumulation in packaging technology have laid a solid technical foundation for the research and development of COB microdisplays. Ledman Optoelectronics began to accumulate packaging patents fifteen years ago. Ledman COB integrated packaging technology has successively overcome nearly 100 technical difficulties in substrates, chip transfer, sealing, online maintenance, reliability, splicing, consistency, correction algorithms, etc.
In the process of developing COB micro-display products, Ledman Optoelectronics has obtained a large number of intellectual property rights. As of the first quarter of 2019, COB micro-display technology has obtained approximately 30 technology patents. At the same time, a considerable part of the technology is not easy to form external patents. As the company's core technical secrets, it has become an important part of Ledman's COB microdisplay intellectual property rights.
Finally, for some core raw materials of COB microdisplays, such as special packaging glue, Ledman Optoelectronics has obtained the intellectual property rights of important core raw materials through industry-university-research cooperation with a number of scientific research institutes and universities such as the Chinese Academy of Sciences and Shenzhen University. It can be said that Ledman COB technology has formed a strong patent pool and has become a strong technical barrier for Ledman Optoelectronics.
ANNA