South Korea KEC developed the world's smallest semiconductor components

Korea KEC company recently successfully developed a world volume leadless type semiconductor component minimum, which will help to realize the miniaturization of electronic products such as mobile phone.

According to South Korean media reports, the semiconductor component named ELP 0.6 mm long, width of 0.3 mm, thickness of 0.28 mm, is a weak signal can be transmitted to separate components. It is only half the size of the world's smallest TFSC semiconductor components, electronic equipment in the installation area of TFSC semiconductor components can save about 70%.

Non lead semiconductor component is a key component to realize the miniaturization of electronic devices such as mobile phones. Compared with the semiconductor component with the lead, the distance between the non lead semiconductor chip and the external substrate is shortened, and the current conduction performance can be improved.