TSLC recently released a complete series of UV LED component products. The UV wavelength range is from 365nm to 420nm, which can be used in nail art lamps, anti-counterfeiting pen equipment, adhesive curing (Curing), printing equipment, PCB exposure and other applications. TSLC’s research and development breakthroughs are almost leading the application of UV LED industry.
TSLC’s UV LED component product development capabilities break through size restrictions, with sizes ranging from 3.5mm x 3.5mm (3W), 5.5mm x 5.5mm (10W) to the largest 9mm x 9mm (24W) All have corresponding products, and in order to meet actual application needs, products with different lens angles have been developed, ranging from small angles of 55 degrees and 65 degrees to large angles of 110 to 140 degrees. Customers can choose the appropriate product according to their equipment needs.
TSLC is good at controlling the heat dissipation requirements of UV LED components. Taiwan’s exclusive aluminum nitride (AIN) substrate packaging technology can effectively conduct chip heat energy to the underlying substrate. This is especially important for high-wattage UV LED components. High-wattage multi-chip packaging products such as the 7070 and 9090 series have extremely excellent heat dissipation characteristics.
The company’s latest UV LED 7070 series can be used for 365nm UV LED applications, and is equipped with the latest quartz glass lens, which can reduce the loss of UV light and increase the uniformity of light output. I believe that TSLC can represent Taiwan, seize the Radtech North American market, and shine in the field of UV LED packaging.
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