Therefore, in order to improve the display effect, the most direct way is to make large-size substrates to reduce the seams and borders caused by module splicing. Because the larger the substrate, the fewer the borders and seams caused by splicing for the same screen size, and the better the display effect. Therefore, many companies have been pursuing larger substrate sizes.
However, in the past, due to the bottleneck of die-hardening technology, large-size substrates, whether used for backlighting or direct display, were restricted, which to a certain extent affected the market promotion and application of large-size Mini LED displays.
In the field of direct display Mini LED display, the process execution barriers mainly come from two aspects:
First, the speed issue
Direct display requires three different colors of red, green and blue chips. In the same size, the number of chips is more than that of the backlight substrate, so the speed requirements are very high. Moreover, in chip solidification production, there will also beHaving a slowdown problem.
The traditional die-bonding technology on the market cannot meet the needs of large substrates in terms of die-bonding efficiency - complete the chip transfer and die-bonding of the entire substrate before the adhesive force of the solder paste is reduced, so as to avoid problems such as chip back-sucking/poor solder melting. In other words, if the crystal bonding is not completely completed, it can only be cleaned and then re-solidified. Therefore, the crystal bonding speed is not enough to make large substrates.
The second is the activation problem
At the beginning of the design, the mechanical structure was not designed to adapt to the large substrate. At the same time, the one-way flow between equipment makes the length of the substrate exceed the distance between the two worktables, causing interference and collision. Therefore, machines need to be connected in parallel.
In the field of backlight, currently, the double-swing arm die-bonding technology has problems with the Yin and Yang surfaces and limited substrate size in the production of large backlight substrates. The reason is that the swing arm is too long and easy to shake, which will affect the accuracy of the crystal bonding, making it difficult to meet the market demand for large-size substrates. Moreover, the partitioned crystal bonding can easily amplify the color difference of the substrate, resulting in uneven brightness of the substrate, affecting the display effect and user experience.
In order to solve the problem of large substrates for direct display and backlight, Zhuoxing Semiconductor has launched two patented products using innovative processes, namely the pixel die-bonding machine and the Ferris wheel die-bonding machine specially designed for large-size substrates. The direct display substrate size has been increased to 270mm*520mm, and the backlight can achieve large substrate die-bonding of up to 500*840mm.It fully meets the requirements of Mini LED direct display/backlight display for large-size substrates.
Actual pictures of pixel die-bonding machine
Actual pictures of Ferris wheel die-bonding machine
01. Direct display large substrate solution
Mixing and solidification does not slow down & improves the whole line utilization rate
The maximum size is increased to 270mm*520mm
Zhuoxing's original pixel die-bonding technology ensures Mini The LED direct display chip can be integrated with precision while achieving the integration of a single device without slowing down. At the same time, it has innovated and optimized the equipment layout. It is the first to put into production a parallel line body to solve the activation problem and achieve greater substrate rotation. It can increase the size of the direct display substrate to a maximum of 270mm*520mm, effectively solving the problem of large-size direct display substrates.
Industry's first pixel die-bonding technology
Mixing and solidification does not slow down
For the direct display field, Zhuoxing Semiconductor Industry pioneered pixel die-bonding technology, which is fast, high-precision, and effectively solves the problem of die-bonding efficiency. The so-called pixel solidification technology can achieve three solidifications in one shot, one pixel positioning, and RGB three-color solidification. The movement path is 1/3 of the traditional solution, and the number of recognitions is 1/3 of the traditional solution, achieving mixed results.It does not slow down the solidification speed and has high die-solidification efficiency. It can solidify 1,000 wafers in one minute, effectively reducing the seams caused by traditional direct display substrate splicing.
Pixel die bonding animation
Zhuoxing pixel die bonding machine has a large effective die bonding range, covering all common module sizes and specifications on the market, and independent parameter settings for RGB three colors to ensure the die bonding yield. It is worth mentioning that Zhuoxing's pixel die-bonding machine is also compatible with large backlight substrates, such as applied to 15-inch or 27-inch automotive displays, and can meet the production needs of backlight and direct display large substrates.
The first in the industry to put into production parallel wire bodies
Effectively solves the operation problem
Zhuoxing pixel die-bonding machine can realize parallel connection production. Through the last-in, last-out line body + pixel die-bonding method, it breaks through the limitations of the original mechanical structure design, greatly improves the utilization rate of the entire line, and effectively avoids interference and collision between machines. On the one hand, it effectively solves the problem of adapting to larger-sized substrates. The current compatible size of direct display substrates reaches 270mm*520mm, which can greatly reduce seams and bring a better visual experience to users; on the other hand, it enhances the flexibility of production lines and achieves large-scale, high-efficiency production of large substrates by merging more machines in line to increase production capacity.
02. Backlight large substrate solution
Uniform brightness & unlimited substrate size
Maximum size increased to 500mm*840mm
Aiming at the "bottleneck" of large-size substrate die-bonding in the backlight field, Zhuoxing Semiconductor Industry exclusively developed the Mini LED Ferris wheel die-bonding machine, which provides a new solution for the production of large backlight substrates. The Mini LED Ferris wheel die-bonding machine adopts a vertical turret design, which allows the substrate size to be unrestricted and the die-bonding operation to be more stable. Currently, the substrate size can be increased to 500mm*840mm. At the same time, Zhuoxing Innovation uses a full-page hybrid die-bonding method to cleverly disrupt the die-bonding positions of different batches of wafers, fundamentally solving the problem of Yin and Yang surfaces and making the overall brightness of the substrate consistent and more uniform.
The innovative research and development of Zhuoxing Mini LED Ferris wheel die-bonding machine not only significantly reduces production costs, but also greatly reduces module splicing and significantly improves the display effect. Moreover, Zhuoxing can provide customized backlight large substrate production solutions according to the needs of manufacturers, helping companies improve quality and efficiency.
As the Mini LED industry enters a higher stage, new demands and new applications have brought new requirements and challenges to key process technologies. Both direct display and backlight are accelerating technological development. Zhuoxing Semiconductor relies on its technologically leading pixel die-bonding machine and Ferris wheel die-bonding machine to provide the industry with solutions to the problem of large substrates for direct display/backlight., to achieve better display effects.
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